Details
- Apple announced a new multiyear agreement with Broadcom to design and produce custom silicon components and wireless connectivity technologies for Apple devices.
- The deal is expected to exceed $30 billion and will support production of more than 15 billion U.S.-made chips and hundreds of American jobs.
- Broadcom will expand and modernize its Fort Collins, Colorado facility with a $1.5 billion capital investment to make advanced RF components, including FBAR filters, and wireless connectivity technologies.
- Apple said this is its largest commitment so far under its American Manufacturing Program, which it launched last year to accelerate U.S. manufacturing.
- The announcement extends Apple’s broader $600 billion, four-year U.S. investment push and builds on the companies’ earlier multiyear chip partnership announced in 2023.
Impact
The deal reinforces the broader U.S. semiconductor reindustrialization trend by shifting more high-value component work into domestic facilities. For Broadcom, the Fort Collins expansion should deepen its role in Apple’s supply chain and sustain manufacturing investment over the next 12–24 months.
